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An image sensor and two custom readout chips for the VeryFastCCD project. These components were designed at Berkeley Lab and wire bonded together in the Engineering Division. The unusual design of these pieces means that the sensor is wire bonded directly to the readout chips on both sides rather than the more traditional method of being bonded to the printed circuit board. (Credit: Phathakone Sanethavong, Berkeley Lab)

Made in Berkeley Lab: Revealing the Secret Miniature World of Wire Bonding

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Engineering

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